Thermal/Mechanical Specifications and Design Guide
15
Package Mechanical Specifications
2
Package Mechanical
Specifications
2.1
Package Mechanical Specifications
The Intel
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-
3930K processor, and Intel
®
Core™ i7-3820 processor are packaged in a 2011-land
Flip-Chip Land Grid Array package that interfaces with the baseboard using the
LGA2011-0 socket. The package consists of a processor mounted on a substrate land-
carrier. An integrated heat spreader (IHS) is attached to the package substrate and
core and serves as the mating surface for processor component thermal solutions, such
as a heatsink.
shows a sketch of the processor package components and
how they are assembled together. Refer to
for complete details on
the LGA2011-0 socket and ILM.
The package components shown in
include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
LGA 2011-0 Socket
System Board
Capacitors
DIE
TIM
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...