LGA2011-0 Socket
20
Thermal/Mechanical Specifications and Design Guide
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate that is integral to having a
uniform load on the socket solder joints and the contacts. Socket loading specifications
are listed in
. Schematic for LGA2011-0 socket is shown in
. The
seating plane is shown on the outer periphery of the socket.
Figure 3-2. Contact Wiping Direction
Contact Wiping Direction
Contact Wiping Direction
Contact Wiping Direction
Figure 3-3. Schematic of LGA2011-0 Socket with Pick and Place Cover Removed
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...