Thermal/Mechanical Specifications and Design Guide
33
Independent Loading Mechanism (ILM)
4.2.2.1
ILM Keying
As indicated in
, the socket protrusion and ILM key features prevent 180-
degree rotation of ILM assembly with respect to socket. This result in a specific
orientation with respect to ILM active lever and pin 1 of the socket body.
4.2.3
ILM Back Plate Design Overview
The back plate consists of a flat steel back plate with threaded studs to attach to the
ILM frame. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors. Two additional cut-outs on the backplate provide
clearance for backside voltage regulator components. An insulator is pre applied by the
vendor to the side with the threaded studs.
Note:
The ILM Back Plate is designed to work with board thicknesses from 0.062 inches to
0.100 inches. If the board is outside of this range, the backplate will require
modification.
Figure 4-8. ILM Keying
If the ILM is attempted to be
installed 180° out of phase, the
ILM frame will interfere with
ILM keying feature molded in
ILM frame will interfere with
socket protrusion
ILM keying feature molded in
socket body and corresponding
ILM key feature in the frame.
Figure 4-9. ILM Back Plate
Clearance cutouts (3x)
6-32 Threaded Studs (4x)
Summary of Contents for BX80619I73820
Page 10: ...10 Thermal Mechanical Specifications and Design Guide...
Page 14: ...Introduction 14 Thermal Mechanical Specifications and Design Guide...
Page 104: ...Thermal Solutions 104 Thermal Mechanical Specifications and Design Guide...
Page 112: ...Mechanical Drawings 112 Thermal Mechanical Specifications and Design Guide...
Page 118: ...Socket Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guide...
Page 124: ...Package Mechanical Drawings 124 Thermal Mechanical Specifications and Design Guide...
