4
Thermal and Mechanical Design Guidelines
Figures
Figure 1. GMCH Non-Grid Array ........................................................................12
Figure 2. Nominal Package Height ....................................................................13
Figure 3. Non-Critical to Function Solder Balls .....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale) ......................................................18
Figure 6. Airflow andTemperature Measurement Locations ....................................19
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on an ATX Platform ............................................................................22
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on a Balanced Technology Extended (BTX) Platform ................................23
Figure 9. ATX GMCH Heatsink - Installed on Board...............................................24
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board25
Figure 11. GMCH Package Drawing ....................................................................30
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms.....................................31
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX)
Platforms ........................................................................................32
Figure 14. GMCH Reference Heatsink for ATX Platforms – Sheet 1..........................33
Figure 15. GMCH Reference Heatsink for ATX Platforms – Sheet 2..........................34
Figure 16. GMCH Heatsink for ATX Platforms – Anchor .........................................35
Figure 17. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ....36
Figure 18. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ....37
Figure 19. GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip .............38
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms .......................................................................................39
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ..............................................................................40
Tables
Table 1.
Package Loading Specifications............................................................12
Table 2.
Thermal Specifications .......................................................................14
Table 3.
ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) ...................................................................................25
Table 4.
Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level) ..........................26
Table 5.
ATX Intel Reference Heatsink Enabled Suppliers for Intel
®
G35
Express Chipset ................................................................................27
Table 6.
Balanced Technology Extended (BTX) Intel
®
Reference Heatsink
Enabled Suppliers for Intel
®
G35 Express Chipset ..................................27
Table 7.
Supplier Contact Information ..............................................................28
Summary of Contents for 82G35
Page 6: ...6 Thermal and Mechanical Design Guidelines...
Page 10: ...Introduction 10 Thermal and Mechanical Design Guidelines...
Page 16: ...Product Specifications 16 Thermal and Mechanical Design Guidelines...
Page 20: ...Thermal Metrology 20 Thermal and Mechanical Design Guidelines...
Page 30: ...Mechanical Drawings 30 Thermal and Mechanical Design Guidelines Figure 11 GMCH Package Drawing...
