Introduction
Thermal and Mechanical Design Guidelines
7
1
Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component.
This document is for the following device:
•
Intel
®
G35 Express Chipset GMCH (82G35 GMCH)
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the GMCH. Properly designed solutions provide
adequate cooling to maintain the GMCH case temperature at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the case to local-ambient thermal
resistance. By maintaining the GMCH case temperature at or below those
recommended in this document, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note:
Unless otherwise specified the information in this document applies to all
configurations of the Intel
®
G35 Express Chipset. The Intel
®
G35 Express Chipset will
be available with integrated graphics and associated SDVO and analog display ports.
The Intel
®
G35 Express Chipset is a Graphics Memory Controller Hub (GMCH) targeted
for use with the Intel
®
Core™2 Duo processor family and Intel
®
Core™2 Quad
processor family in the LGA775 Land Grid Array Package and the Intel
®
ICH8 in
desktop platforms.
Note:
In this document the use of the term chipset refers to the combination of the GMCH
and the Intel ICH8. For the ICH8 thermal details, refer to the
Intel
®
I/O Controller Hub
8 (ICH8) Thermal Design Guidelines.
Summary of Contents for 82G35
Page 6: ...6 Thermal and Mechanical Design Guidelines...
Page 10: ...Introduction 10 Thermal and Mechanical Design Guidelines...
Page 16: ...Product Specifications 16 Thermal and Mechanical Design Guidelines...
Page 20: ...Thermal Metrology 20 Thermal and Mechanical Design Guidelines...
Page 30: ...Mechanical Drawings 30 Thermal and Mechanical Design Guidelines Figure 11 GMCH Package Drawing...
