Reference Thermal Solution
Thermal and Mechanical Design Guidelines
25
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board
4.4
Environmental Reliability Requirements
The environmental reliability requirements for the reference thermal solution are
shown in Table 3 and Table 4. These should be considered as general guidelines.
Validation test plans should be defined by the user based on anticipated use
conditions and resulting reliability requirements.
The ATX testing will be performed with the sample board mounted on a test fixture
and includes a processor heatsink with a mass of 550g. The test profiles are
unpackaged board level limits.
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level)
Test
1
Requirement Pass/Fail
Criteria
2
Mechanical
Shock
•
3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
•
Profile: 50 G, Trapezoidal waveform, 4.3 m/s
[170 in/s] minimum velocity change
Visual\Electrical
Check
Random
Vibration
•
Duration: 10 min/axis, 3 axes
•
Frequency Range: 5 Hz to 500 Hz
•
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual/Electrical
Check
Unbiased
Humidity
•
85 % relative humidity / 55
°
C, 576 hours
Visual Check
NOTES:
1.
The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2.
Additional Pass/Fail Criteria may be added at the discretion of the user.
Summary of Contents for 82G35
Page 6: ...6 Thermal and Mechanical Design Guidelines...
Page 10: ...Introduction 10 Thermal and Mechanical Design Guidelines...
Page 16: ...Product Specifications 16 Thermal and Mechanical Design Guidelines...
Page 20: ...Thermal Metrology 20 Thermal and Mechanical Design Guidelines...
Page 30: ...Mechanical Drawings 30 Thermal and Mechanical Design Guidelines Figure 11 GMCH Package Drawing...
