Intel 82G35, Design Manuallines

Page: 32 / 40

Mechanical Drawings
32
Ther
mal and Mechanical Design Guidelines
Figure 13. GMCH Keep-Out
R
e
st
rict
ions f
o
r Ba
lanced Technology Extended (BTX) Platforms
1
3
4
5
6
7
8
B C D
A
1
2
3
4
5
6
7
8
B C D A
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
51.4
2.024
[]
61.98
2.440
[]
55.88
2.200
[]
48.26
1.900
[]
4X 8.76
.345
[]
4X 5.08
.200
[]
4X 4.19
.165
[]
4X 2.095
.082
[]
2X 3.3
.130
[]
2X 2.29
.090
[]
2X 5.72
.225
[]
2X 2.54
.100
[]
44
1.732
[]
SHEET 1
OF
1
DO NOT SCALE DRAWING
SCALE: 4
0.4
D24866
D
REV
DRAWING NUMBER
CAGE CODE
SIZE
BROADWATER BTX KEEP OUT ZONE
TITLE
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
CORP.
R
TMI
DEPARTMENT
NA
FINISH:
NA
MATERIAL:
mm/dd/yy
DANA GRINDLE
DATE
APPROVED BY
mm/dd/yy
X
DATE
CHECKED BY
06/01/05
KG TAN
DATE
DRAWN BY
mm/dd/yy
KG TAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: LINEAR TOL
0.1
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
***
0.1
PRELIMINARY RELEASE
mm/dd/yy
X
B6,C6
0.4
CHANGE MAX COMP HEIGHT FROM 1.27MM TO 1.55MM
06/24/05
D24866
1
0.4
DWG. NO
SHT.
REV
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY PER ASSY
-001
-002
-003
D24866
TOP
COMPONENT CENTER
MAX 1.27 [.050] COMPONENT HEIGHT (NON-MCH COMPONENTS)
NO COMPONENTS THIS AREA
NOTES:
1
HOLE PLACEMENT FABRICATION
TOLERANCE PER INTEL 454979, CLASS 1,2,3 2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED 34.3MM ABOVE MOTHERBOARD SURFACE.
MAX 1.78 [.070] COMPONENT HEIGHT
MAX 1.55 [.060] COMPONENT HEIGHT (NON-MCH COMPONENTS)
SEE DETAIL
A
SEE DETAIL
B
DETAIL
A
SCALE
8
4X
D PLATED THRU HOLE
4X
1.42[.056] TRACE KEEPOUT
DETAIL
B
SCALE
6