Product Specifications
14
Thermal and Mechanical Design Guidelines
2.4.2
Methodology
2.4.2.1
Pre-Silicon
To determine TDP for pre-silicon products in development, it is necessary to make
estimates based on analytical models. These models rely on knowledge of the past
GMCH power dissipation behavior along with knowledge of planned architectural and
process changes that may affect TDP. Knowledge of applications available today and
their ability to stress various aspects of the GMCH is also included in the model. The
projection for TDP assumes GMCH operation at T
C-MAX
. The TDP estimate also accounts
for normal manufacturing process variation.
2.4.2.2
Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.
2.4.3
Specifications
The data in Table 2 is based on post-silicon power measurements of the GMCH. The
system configuration is: two (2) DIMMs per channel, DDR2, FSB operating at the top
speed allowed by the chipset with a processor operating at that system bus speed. FC-
BGA packages have poor heat transfer capability into the board and have minimal
thermal capability without thermal solutions. Intel requires that system designers plan
for an attached heatsink when using the GMCH.
Table 2. Thermal Specifications
Component System
Bus Speed
Memory
Frequency
T
C-
MIN
T
C-MAX
Max
Idle
Power
TDP
Value
Intel
®
82G35 GMCH
1333 MHz
800 MHz
0 °C
97°C
11 W
28 W
NOTES:
1.
Thermal specifications assume an attached heatsink is present.
2.
Max Idle Power is the worst case idle power in system booted to Windows* with no
background applications running.
3.
When an external graphics card is installed in a system with the Intel
®
G35 Express
Chipset, the TDP for this part will drop to approximately 19 W. The GMCH will detect the
presence of the graphics card and disable the on-board graphics resulting in the lower
GMCH TDP.
2.4.4
T
CONTROL
Limit
Intel
®
Quiet System Technology (Intel
®
QST) monitors an embedded thermal sensor.
The maximum operating limit when monitoring this thermal sensor is T
CONTROL
. For the
GMCH this value has been defined as 95 °C. This value should be programmed into
the appropriate fields of Intel QST as the maximum sensor temperature for operation
of the Intel 82G35 GMCH.
Summary of Contents for 82G35
Page 6: ...6 Thermal and Mechanical Design Guidelines...
Page 10: ...Introduction 10 Thermal and Mechanical Design Guidelines...
Page 16: ...Product Specifications 16 Thermal and Mechanical Design Guidelines...
Page 20: ...Thermal Metrology 20 Thermal and Mechanical Design Guidelines...
Page 30: ...Mechanical Drawings 30 Thermal and Mechanical Design Guidelines Figure 11 GMCH Package Drawing...
