FIRMWARE INFORMATION
*System Firmware A Revision: 3.02 [4819]
System Firmware B Revision: 3.02 [4819]
BMC Revision: 5.20
Management Processor Revision: T.02.17
Updatable EFI Drivers:
Floating Point Software Assistance Handler: 00000118
Broadcom Gigabit Ethernet Driver: 00090404
SCSI Bus Driver: 00000031
SCSI Disk Driver: 00000020
SCSI Tape Driver: 00000030
Usb Ohci Driver: 00000040
USB Bus Driver: 00000020
USB Bot Mass Storage Driver: 00000020
Generic USB Mass Storage Driver: 00000020
CLPrelay App: 00000100
* Indicates active system firmware image. In this case =>3.02 indicates that this server does not
need system firmware updated to use the memory modules described in this document.
The firmware upgrade instructions are included in the Release Notes on the firmware package
download page for your server product. To locate the Release Notes and download the firmware:
1.
Go to
http://www.hp.com/bizsupport
.
2.
Select
Download Drivers and Software
.
3.
Select
HP Integrity Servers
.
4.
Select the link for your server product.
After the firmware has been downloaded, you can install the memory. To install DIMMs, see
“Installing DIMMs” (page 36)
.
Power Subsystem
The power subsystem is located on the system board. Each server blade receives bulk DC voltage
from the enclosure. The server blade power block converts the DC voltage from the enclosure to
the voltage required by the server blade. The BL870c server blade receives 12 V directly from the
enclosure. The voltage passes through E-Fuse circuitry that resides in the blade. The 12 V supply
is always on as long as a power supply is installed in the enclosure. A control line from the enclosure
onboard administrator (OA) can turn the E-Fuse on or off to supply or cut power to the blade. The
12 V gets distributed to various point-of-load (POL) converters.
Processor and Core Electronics Complex
The BL870c processor subsystem holds up to four Intel Itanium dual-core processors. It consists of
the zx2 core electronics complex (CEC), a front side bus, a memory and I/O controller, system
clock generation and distribution, multiple POL converters, and I
2
C circuitry for manageability and
fault detection.
The front side bus speed is 267 MHz. The zx2 CEC and the processor modules are located on
the system board. Four Zero Insertion Force (ZIF) sockets connect the processors to the system
Server Blade Components
19
