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F&S Bondtec 56 i Series User Manual Download Page 40

Multiwire Program

© 2020 F&S BONDTEC Semiconductor GmbH. All rights reserved.

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Figure 9.3. - 1    

Module Matrix 

TIP

Modules can only be duplicated if the entire component is repeated several times. If only individual areas 
or chips on a component are identical, it is better to work with copies. See Copy Paste.

9.4

Normalize Program

With Normalize program, after an adjustment process all chip and bond positions are moved as if the program had 
been trained at this position. The state of the first programmed part can be restored.

This is necessary if you want to change the PRU positions of an already finished program.

>> 

Position changes at <Learn Wire> are possible if <Adjust> was done before.

9.5

Measure Chipheights

Measure Chipheights is used to measure missing heights if this was not possible in Learn Chip due to the component 
geometry.

The function is called with <Mode><Measure Chipheights>. Afterwards 'Measure All Chip Heights' or 'Measure mis-
sing chipheights' can be selected. With <Start> the process is started.

After the measuring process the heights can be saved with OK.

9.6

Move the Bond Program 

9.6.1 MoveProgram XY

This function is useful if you have made changes to the part holder etc.

It can be accessed through <Mode> <Move Program XY>. Here the whole program can be moved by one offset. Teach 
in as usual with <Store Trace>. Then confirm with OK.

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Summary of Contents for 56 i Series

Page 1: ...Series 56XXi F S BONDTEC Semiconductor GmbH User manual BONDSTAR 2 0 ...

Page 2: ...F S BONDTEC Semiconductor GmbH Industriezeile 49a 5280 Braunau am Inn Austria Copyright 2020 F S BONDTEC Semiconductor GmbH Reserve technical changes ...

Page 3: ...ONS 10 3 1 Dimension and Weight 10 3 2 Workspace 10 3 3 Environmental conditions and connections 11 3 4 Bondhead 11 3 5 Spezification 12 4 MODEL 56XXI 13 4 1 Overview of the multifunction device 14 4 2 Control Elements 14 4 3 The Axes of the Motion System 15 4 4 Bond heads 16 5 TRANSPORT AND INSTALLATION 19 5 1 Transport Packaging 19 5 2 Storage 19 5 3 Suitable Operating Location 19 5 4 Preparator...

Page 4: ...ting Wires with Learn Wire 37 9 3 Duplicating Modules 37 9 4 Normalize Program 38 9 5 Measure Chipheights 38 9 6 Move the Bond Program 38 9 7 Change Bondprogram with Plot Program Show Program 39 9 8 Production Operation 42 9 9 Quality control 43 9 10 Pattern recognition 43 10 CALIBRATIONS 45 10 1 Camera Convex Compensation 45 10 2 Head Calibration 45 10 3 Camera Offset 46 10 4 Axis Calibration 46 ...

Page 5: ... 8270 Fax 43 7722 67 05 2 8272 http www fsbondtec at 1 1 2 Scope of Supply The scope of supply is Bond head Accessories as listed on delivery note Documentation 1 1 3 Nameplate The nameplate is located on the right hand side of the machine Always quote the serial number in all corresponden ce relating to service The serial number appears again on a second separate plate affixed on the same side of...

Page 6: ...Catastrophes influence of foreign matter and acts of God The installation of any programs Network connection during operation Alterations additions to and conversions of the machine undertaken without the prior approval of F S Bondtec are strictly prohibited Conversions always require the manufacturer s prior written consent Structural alterations undertaken without prior written consent void your...

Page 7: ... No part of this documentation may be reproduced duplicated or transmitted in any form without the express written permission of F S BONDTEC 1 2 Scope of Documentation The entire documentation consists of User Manual this manual Additional information such as List of recommended spare parts bond head clearance diagrams etc Please refer also to http www fsbondtec at ...

Page 8: ... observed The rules and regulations for accident prevention and environmental protection valid for the place of use must be provided and observed by the operator On the even page numbers the issue number is printed on the cover and the headers show the issue version of the user manual from which this operating manual is valid IMPORTANT If necessary please observe the appendices of individual compo...

Page 9: ...octor Do not reach into the working area of the machine during operation Risk of injury There is a risk of crushing in the area of the cross table X and Y axis and substrate pickup Only operate the machine when all covers are mounted Do not remove covers when the machine is in operation Risk of injury Do not work with long loose hair or loose hanging jewelry chains etc on the machine These could g...

Page 10: ...ns no hazardous substances However hazardous substances can be used in cleaning e g ace tone When handling cleaning agents observe the corresponding safety regulations of the manufacturer Heated substrate shots For bonding with gold wire a temperature 100 C is necessary The substrate is heated via the substrate holder 2 7 Protective Equipment Personal Protective Equipment Before starting the machi...

Page 11: ... staff has to be clearly defined for assembly commissioning operation set up maintenance and repair Staff to be trained may only work on the machine under the supervision of an experienced person All persons entrusted with the installation commissioning operation and maintenance of the machine undertake to Read all safety instructions and warnings in this user manual carefully Observe the regulati...

Page 12: ...d Weight Dimensions weight free space required table size 3 2 Workspace Dimension and weight Height ca 700 mm Width ca 700 mm Depth ca 650 mm Weight basic equipment ca 75 kg Free space front free accessible back 100 mm for maintenance 500 mm lateral 40 mm above 100 mm Required table size Width with Monitor with lateral placement of the monitor min 780 mm min 1100 mm Depth min 750 mm X Y and Z Axis...

Page 13: ...m 70 dBA Connection Data Nominal voltage 90 260 V AC Voltage frequency 50 60 Hz Nominal current 110 120 V 200 240 V 5A 3 15 A Power consumption 450 W Compressed air oil and water free according to DIN ISO 8573 1 goods class 2 min 4 5 bar 6 bar Ø 6 mm outside Vacuum connection 300 mbar Ø 6 mm outside 5610i Wire diameter 17 µm to 50 µm 0 7 mil to 2 mil Wire guide 90 Capillary 16 mm optional stehen a...

Page 14: ...urchase contract 5632i Wire diameter 17 µm to 75 µm 0 7 mil to 3 mil in addition Ribbon Wire to 250 µm x 30 µm 10 mil x 1 2 mil Wire guide 90 Bond tool 19 05 mm or 1 25 4 mm Bond strength programmable resolution 1cN 5650i 5650i HR Wire diameter 100 µm to 500 µm 4 mil to 20 mil 300 µm to 2000 µm Ribbon Wire guide 55 Clip fixing Bond tool 2 Standard 50 mm V Groove 100 µm 500 µm Bond strength program...

Page 15: ...NT Some illustrations and detailed descriptions in this manual may differ from the actual machine if the hard ware of the machine has been customized The following chapters assume a basic knowledge of electronics especially of wire bonding technology TIP You can find more information about wire bonding on the Internet ...

Page 16: ...4 2 2 EMERGENCY STOP Button The machine stops immediately when the EMERGENCY STOP button is pressed 4 2 3 Monitor All process relevant information is displayed to the user on the monitor 4 2 4 Microscope The microscope is an optical tool and is used for setup as well as for the control of the process optimization 4 2 5 US Generator The US generator acts as an electrical ultrasound source 4 2 6 Joy...

Page 17: ...ected to the positioning system of the machine The product to be processed is fixed to the component holder during the bonding process 4 2 11 Bondhead The bond head contains the components and calibration data required for bonding It carries out the welding process and together with the motion system generates the desired wire connections via a previously defined motion se quence 4 3 The Axes of t...

Page 18: ...guide guides the wire from the wire spool to the tip of the bonding tool Turning head contains those components that require a wire connection for generation Touchdown Sensor detects the placement of the bonding tool on the component sur face the measured values supplied by the sensor are also dis played graphically on the monitor Transducer converts an electrical oscillation into a mechanical osc...

Page 19: ...5µm 0 7mil to 3mil can be welded on suitable surfaces Figure 4 4 1 Thin Wire Head 5630i 4 4 3 5632i Thin Wire Head The 5632i Deep Access Bond Head features a special design of the bond head This gives the bonder a high flexibility In contrast to the 5630i this head is especially suited for bonding into deeper packages Ribbon Wire from 30 µm 250 µm 1 2 mil 10 mil can also be processed Figure 4 4 1 ...

Page 20: ...in wire bonding heads the heavy wire bonding head has a knife built in front or back cut possible The finished bonded wire is cut off here because the wires are too thick to tear The cutting process is automatically integrated into the software when the 5650i head is attached The Heavy Ribbon version of the 5650i bond head is an ultrasonic wedge bonder for thick aluminum strips up to 2000 x 300 µm...

Page 21: ...paint coat the bonder must be inspected for signs of corrosion after a longer storage period 5 3 Suitable Operating Location The following requirements must be met before the machine can be installed Select the location so that it is easily accessible from all sides Make sure that nobody can be endangered by the running machine To work with maximum accuracy the bonder must be placed on a stable no...

Page 22: ...s When working on live parts the machine must be disconnected from the power supply system Electri cal lines must be installed and mounted properly Fittings length and quality of the cables must comply with local regulations The electrical equipment must be checked regularly Loose and damaged cables must be replaced immediately DANGER Access to the electronics and power supply must always be kept ...

Page 23: ...the machine or its components on the wrong voltage The equipment could be damaged 5 6 Vacuum Connection Figure 5 6 1 Vacuum connection Connect the bonder to the vacuum net through the socket shown in the picture 5 7 Connection of the Ultrasonic Generator The ultrasonic generator must be connected to the corresponding connection cables of the bonder Depending on the specified ultrasonic generator t...

Page 24: ...ke sure that the machine is in perfect safe operating condition and that all safety precautions are observed After switching on the main switch the operating system boots and you will find a standard Windows TM interface The F S BONDTEC Bonder application can then be started from the desktop by double clicking on it After confirming the question Do you want to move Home the Z P X Y axes of the mac...

Page 25: ...tion 6 1 2 Main Toolbar It contains buttons for quick access to the most important functions of the bonder Machine Mode In Single Wire mode a single wire can be bonded This mode is mainly used to find the parameters for a product being processed for the first time In Multi Wire mode a complex component can be processed automatically or semi automatically 6 1 3 Expiration Quick Access Allows operat...

Page 26: ... to their original position with or with the Home button on the keypad Under Page Global Program Settings in the tab Main you can select the X Y direction and in the tab Tuning the speed of the joystick movement Wire Clamp With the button Wireclamp on the keypad the wire clamp can be opened closed Wire feed FlameOff With head type 5X10 pressing the Wirefeed FlameOff button will raise the transduce...

Page 27: ...removed to create a ball at the end of the wire With the button Flame off Wire Feed you can start the FlameOff process manually The programmable FlameOff parameters can be found under Page Global Program Settings Process Depending on the wire diameter you can roughly select the power output in the High and Low range In addition the fine adjustment of the ignition voltage by means of Current and Ti...

Page 28: ...ual creation of a bond program Any previously loaded bonding programs are deleted from the wor king memory when a new bonding program is created Parameters for bonding are usually taken from the Single Wire dialog of the last loaded bonding program By selec ting Create from Default Value guide values for different wire thicknesses can optionally be loaded from the data base The global light and ca...

Page 29: ...ed The welding process then begins creating an inter metallic bond between the wire and the surface of the substrate Loop Subsequently the bond head is moved to the next bond point in a previously defined sequence This movement crea tes and forms the so called loop Chain A loop and the welding point at the end of the loop form a chain After the 1st bond 0 1 or more chains can follow Termination At...

Page 30: ...sition All bond positions must be taught in once with Store Trace which also measures the height at each bond position Pressing Bond jumps to the next bond There the light and camera settings also have to be adjusted You can switch to the previous or next bond position at any time using the arrow keys or by clicking on the respective tab to move the bond positions there again The position is confi...

Page 31: ...observed The Step Mode can be activated and deactivated at any time with the Step key on the keypad If the Step Mode is activated the automatic motion sequence is interrupted immediately You can activate this function in Single Wire as well as in Multi Wire mode In Step Mode a graphic with additional information about the bonding process is displayed instead of the camera image Furthermore the nex...

Page 32: ... more time means more energy for the welding process Thinner heavy wires need comparatively less energy therefore less time than thicker wires Therefore the time for 100µm wire diameter can be only 50 100ms 8 1 2 US Power The US Power parameter regulates how strongly the bond tool oscillates and thus how strong the weld will ultima tely be More US Power means a stronger deformation of the welded a...

Page 33: ...e of the component too much US Power with too little Bondforce As a result an Al deposit will also form very quickly on the bonding tool and premature wear of the bonding tool will occur 8 1 4 Touchdown Steps The TD Steps create the area to deform the wire during the bonding process As a guideline half the wire diameter is used IMPORTANT The rules are slightly different when it comes to ball bondi...

Page 34: ...onding tool at a 45 angle but in the ball wedge process the wire is fed through the capillary bonding tool at a 90 angle This results in fundamentally different loop geometries in the bonding processes mentioned above 8 2 1 Standard Loop Standard Loop at Wedge Wedge Typically a loop in wedge wedge bonding has a maximum height in relation to the length of the wire bond of appro ximately 1 3 This re...

Page 35: ...should be activated for this bonding process TIP In most cases it is sufficient to use a reverse movement In case a reverse movement is used to bend the wire slightly after about 30 of the loop length Use Reverse 1 can be activated and the following parameters can be used When using the above parameters a bend will be created after 1 3 of the loop which will then form the highest point of the loop...

Page 36: ... the possibility to move behind the 2nd bond point and to prevent the bending of the wire at the first bond point and also the lateral bending to a large extent by an arc shaped movement You define with UTurn how far the wire should be passed and with Loop Point 1 2 at which height between loop height and height of the second bond point the maximum pass position is reached or at which this pass po...

Page 37: ...e of the thin wire the wire is torn either only the clamp is moved Feed Limiter or XYZ moves to tear the wire Table Tear In the case of a table tear the tail for the next bond is created at the same time For the thick wire the wire is cut with a knife but the knife is also moved with the YXZ axis before the cut behind the bond The mechanical adjustment of the knife distance to the bond tool also i...

Page 38: ...les simplify the processing of several identical components on one carrier The sum of all chips from chip 1 and all wires results in module 1 Module 1 represents a template for all other modules So if you change any wires or chips it will be effective on all modules All modules are located on the carrier Chip 0 Differences to Single Wire Unlike the Single Wire program all bonds are assigned to chi...

Page 39: ...he cursor to Bond Position X or Y Set the crosshairs with joystick to the desired bond position Then press Store Trace to accept the XY coordinates TIP As in the SingelWire mode the learned wire can be bonded with the Bond button Bond 9 3 Duplicating Modules 9 3 1 Repeat Module With the function Mode Repeat Module a module can be duplicated Starting with Module 2 the repeat position can be taught ...

Page 40: ... Position changes at Learn Wire are possible if Adjust was done before 9 5 Measure Chipheights Measure Chipheights is used to measure missing heights if this was not possible in Learn Chip due to the component geometry The function is called with Mode Measure Chipheights Afterwards Measure All Chip Heights or Measure mis sing chipheights can be selected With Start the process is started After the ...

Page 41: ...or ori entation and for complex changes of the program data The Reset Zoom function is used to fit the bond program into the window If Show Modules is enabled all modules are displayed otherwise only Module 1 With the mouse wheel you can zoom into the display With the mouse wheel pressed the zoomed display can be moved with the mouse Move Bondhead To In this mode the active wire is displayed in bl...

Page 42: ...am Then select the wire segments to be changed right mouse button under Edit Wires open the respective parame ter dialogs Figure 9 7 1 Dialog Edit Wire The selected wire segments are displayed in blue The reference segment is displayed in red If a parameter is not the same for all wire segments it is highlighted in yellow Click on a wire segment to change the reference object If you select Isolate...

Page 43: ...individually with Store Trace With the button Rotate the copy can be rotated Confirm with OK 9 7 4 Repeat Group Multiple wires are automatically duplicated Unlike Repeat Wire only a single XY offset can be defined for all bond positions The Repeat Group is well suited for duplicating repetitive wire sequences In mode select one or more wires then right click Repeat Group The first step is to defin...

Page 44: ...nd program automatically With the automatic processing can be started The prerequisite for this is that Multiwire is selected and a program suitable for the product has been previously created or loaded from the database Afterwards the Manual Adjust Window appears for each adjustment point There the component can be set up with the joystick and confirmed with Adjust After the Adjust process the pr...

Page 45: ...cally search for adjustment points It replaces the manual adjustment via the joystick Models are taught in the Learn Chip which are then used during processing The pattern recognition can be activated in the Learn Chip mode For this purpose Use Pattern Recognition is set Afterwards two dashed rectangles and several new buttons appear in the live video The inner of the two rectangles is the area wh...

Page 46: ...es the distribution of the different gray tones in the selected image section With Downscale the image resolution can be adjusted For coarse structures you can work with a larger downscale to blur the image which can be helpful in such a case With Countour there are two more parameters Min Contrast defines the minimum threshold value for a detected edge Min Length filters out shorter contour piece...

Page 47: ... to step 2 There the crosshairs which are then located in the lower right corner of the camera image must again be brought into exact alignment with the previously selected structure The positions are saved with Store Trace 10 2 Head Calibration 10 2 1 Bond Weight Bond weight calibration is necessary to define how much current must flow through the bond weight unit to achieve the programmed bond w...

Page 48: ...e of the displayed rectangle to the actual tool size and position the rectangle over the bond area You can also use the virtual joystick to do this Accept the position with the Store Trace button Repeat for all bonded wires The deviations are shown in a graph Save the entries with OK 10 4 Axis Calibration Since every mechanical part has a certain manufacturing inaccuracy there can be deviations in...

Page 49: ...ion such as a fin gerprint can lead to a bad quality of the bond IMPORTANT For thin wire bonders use only 2 wire spools For heavy wire bonders 4 coils are suitable Attach wire spool Loosen and remove the clamping disk this should also not be touched Put on the wire spool the start green should be on top Put on clamping disk and secure with a threaded pin Change wire coil If the spool is not yet em...

Page 50: ...Adjustment Work on the Bondhead 2020 F S BONDTEC Semiconductor GmbH All rights reserved 48 Figure 11 1 2 Wire Path 5630i Figure 11 1 3 Wire Path 5632i ...

Page 51: ...ut of the transducer Insert new bonding tool into the transducer from below Align the bonding tool so that the upper edge of the bonding tool is flush with the upper edge of the transducer Tighten the clamping screw with a 18 cNm or 40cNm heavy wire torque wrench Figure 11 2 1 Transducer After a change the chip heights should be measured again The camera offset calibration is also required if a si...

Page 52: ...All rights reserved 50 11 3 Mechanical Settings 11 3 1 Bracket Settings 5610 Figure 11 3 1 Bracket settings 5610i 1 Set FlameOff Lance vertically Release clamping screw Set holder with grub screw at the top 2 Set the clamp horizontally Figure 11 3 2 Clamp 5610i 1 2 1 2 ...

Page 53: ... engine is swung out The FlameOff Lance is moved under the capillary with the rotary magnet to flame off the wire and form the ball DANGER Before working on the Flame Off Lance switch off the bonder and pull the power plug Danger of electric shock For persons with pacemaker there is danger to life Exercise extreme caution when working in the working area of the machine Do not reach into the workin...

Page 54: ...e clamp uni vertically Loosen clamping screw Adjusting the height of the clamp Retighten clamping screw Figure 11 3 2 Bracket settings 5630i Adjust opening width Loosen the locknut Turn stop screw Close the locknut 2 Change the clamp pressure Loosen lock nut Adjust opening width as desired with grub screw 11 3 3 Bracket Settings 5632i Figure 11 3 1 Bracket settings 5632i 1 2 1 2 ...

Page 55: ...etween the wire clamp and the bonding tool 11 3 4 Knife Settings 5650i HR Figure 11 3 1 Knife settings 5650i HR 1 Adjust the distance between the knife and the tool Adjust grub screw as desired If necessary loosen the fastening of the knife 2 Adjust the height of the knife Loosen both clamping screws Loosen tighten stop screw If necessary push the knife forward Tighten both clamping screws 3 Horiz...

Page 56: ...ble stop screw allows precise adjustment IMPORTANT The clamping pressure must only be adjusted to the wire diameter if necessary Less pressure to avoid marks on thin wires Higher pressure to prevent the wire from slipping through when the wire is thick 11 4 Cleaning of the Components DANGER Never use sandpaper or abrasive cleaning agents to clean components A lint free cloth soaked in pure al coho...

Page 57: ...nding process due to retightening of the wire For this rea son it should be checked regularly and replaced if necessary 11 4 4 Wire Clamp The wire clamp should be checked monthly for deposits and cleaned if necessary This can be done in the installed condition Open the wire clamp with the Wire Clamp button Soak a clean and lint free piece of paper with pure alcohol or acetone Move the paper back a...

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