6.3. Frequently Returning Operation
25
6.4. Create a Bond Program
26
6.5. Further Process Parameters
26
7. THE SINGLE WIRE MODE
27
7.1. Bonding in Single Wire Mode
28
7.2. Working in Single Step Mode (Step Mode)
29
8. PROCESS OPTIMIZATION
30
8.1. Bond parameters
30
8.2. Loop
32
9. MULTIWIRE PROGRAM
36
9.1. Creating Chips with “Learn Chip“
36
9.2. Creating Wires with Learn Wire
37
9.3. Duplicating Modules
37
9.4. Normalize Program
38
9.5. Measure Chipheights
38
9.6. Move the Bond Program
38
9.7. Change Bondprogram with Plot Program (Show Program)
39
9.8. Production Operation
42
9.9. Quality control
43
9.10. Pattern recognition
43
10. CALIBRATIONS
45
10.1. Camera Convex Compensation
45
10.2. Head Calibration
45
10.3. Camera Offset
46
10.4. Axis Calibration
46
11. ADJUSTMENT WORK ON THE BONDHEAD
47
11.1. Bonding Wire
47
11.2. Bond tool
49
11.3. Mechanical Settings
50
11.4. Cleaning of the Components
54