EMC2 VNXe3150, Hardware Information Manual

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38 EMC VNXe3150 Hardware Information Guide
Overview
LCCs
An LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and expansion to
downstream devices.
Figure 31 on page 44 shows an enclosure address (EA
6
) indicator
that is located on each LCC. Figure 31 on page 44 shows an example of an LCC bus (loop)
identification indicator.
Power supply/cooling module
The power supply/cooling module integrates independent power supply and blower
cooling assemblies into a single module.
Each power supply is an auto-ranging power-factor-corrected, multi-output, off-line
converter with its own line cord. The drives and LCC have individual soft-start switches
that protect the disk drives and LCC if you install them while the disk enclosure is powered
up. A disk or power supply with power-related faults will not affect the operation of any
other device.
Figure 28 on page 42 shows the three status LEDs on the power supply/cooling module.
The enclosure cooling system consists of dual-blower modules in each power
supply/cooling module.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DAE disk drives. The VNXe3150 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
2U, 12 (3.5-inch) DAE
On the front, viewing from left to right, the 2U, 12 (3.5-inch) disk drive DAE carrier includes
the following hardware components:
◆
3.5-inch 6-Gb/s SAS or 6-Gb/s NL-SAS disk drives (hot-swappable)
7
◆
Status LEDs
Figure 26 on page 39 shows the location of these components.
6. The EA is sometimes referred to as an enclosure ID.
7. You can add or remove a disk drive while the DAE is powered up, but you should exercise special
care when removing drives while they are in use. Disk drives are extremely sensitive electronic
components.