EMC2 VNXe3150, Hardware Information Manual, Page: 16 / 56

14 EMC VNXe3150 Hardware Information Guide
Overview
Disk drives
You can visually distinguish between drive types by their different latch and handle
mechanisms and by the type, capacity, and speed labels on each drive. You can add or
remove a disk drive while the DPE is powered up, but you should exercise special care
when removing drives while they are in use. Disk drives are extremely sensitive electronic
components. For more information about the supported disk drives for the VNXe3150,
refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing SPs. It distributes
power and signals to all components in the enclosure. SPs and disk drives plug directly
into the midplane.
Storage processor
The storage processor (SP) is the intelligent component of the disk processor enclosure
(DPE). Basically, it acts as the control center. Each SP includes status LEDs, an I/O
personality module, LAN ports, and so on. Two latches on the SP lock it into place to
ensure proper connection. The
“DPE” section on page 19 provides more information
about the location and description of the connectors and LEDs.
Power supply module
When viewed from the rear, the power supply module is located on the top, left and right
of the DPE. This module is an auto-ranging, power-factor-corrected, multi-output, off-line
converter with its own line cord. Each power supply module includes status LEDs. A latch
on the power supply module locks it into place to ensure proper connection. The
“AC
power supply/cooling module” section on page 20 provides more information about the
location and description of the connectors and LEDs.
Cache Protection Module
In a single SP configuration, the Cache Protection Module provides mirrored VNXe
Operating Environment (OE) cache memory that is not possible with a single SP. The Cache
Protection Module capacity is 1 GB.
In the event of a power failure, the system battery provides the power necessary for the
Cache Protection Module to write the entire contents of the mirrored cache memory to
non-volatile storage or Flash memory in the Cache Protection Module. The
“Cache
Protection Module” section on page 34 provides more information about the location and
description of the connectors and LEDs.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DPE disk drives. The VNXe3150 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.