Manufacturing information
Recommended solder reflow cycle
XBee/XBee-PRO® S2C ZigBee® RF Module
300
Recommended solder reflow cycle
The following table lists the recommended solder reflow cycle. The chart shows the temperature
setting and the time to reach the temperature.
Time (seconds)
Temperature (°C)
30
65
60
100
90
135
120
160
150
195
180
240
210
260
The maximum temperature should not exceed 260 °C.
The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the
device while the solder is molten, as parts inside the device can be removed from their required
locations.
Hand soldering is possible and should be done in accordance with approved standards.
The XBee/XBee-PRO ZB RF Modules are level 3 Moisture Sensitive Devices. When using this kind of
device, consider the relative requirements in accordance with standard IPC/JEDEC J-STD-020.
In addition, note the following conditions:
a. Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b. Environmental condition during the production: 30°C /60% RH according to IPC/JEDEC J-STD -
033C, paragraphs 5 through 7.
c. The time between the opening of the sealed bag and the start of the reflow process cannot
exceed 168 hours if condition b) is met.
d. Baking is required if conditions b) or c) are not met.
e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.
f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at
125°C.
Recommended footprint
We recommend that you use the following PCB footprint for surface-mounting. The dimensions
without brackets are in inches, and those in brackets are in millimeters.