1.4
Package Dimensions
G-
TW
-0007437.
4.
2
C
a
2X
A1 Corner
Index Area
C
3
f
C
g
C
Seating
Plane
2
Øh
Øj
Øb
nX
1
M
M C
C
A B
A
C
a
2X
D
C
A
(A3)
(A2)
A1
E
E1
SE
e
Bottom View
SD
e
j
h
g
f
D1
Top View
10 9
8
7
6
5
4
3
2
1
K
J
H
G
F
E
D
C
B
A
Dimension
Min
Typ
Max
Dimension
Min
Typ
Max
A
0.8
0.87
1.0
e
-
0.5
-
A1
0.16
-
0.26
f
-
0.10
-
A2
-
0.21
-
g
-
0.08
-
A3
-
0.45
-
h
-
0.15
-
a
-
0.05
-
j
-
0.08
-
b
0.27
-
0.37
n
-
68
-
D
5.45
5.5
5.55
SD
-
0.25
-
D1
-
4.5
-
SE
-
0.25
-
E
5.45
5.5
5.55
Ball diam.
-
0.3
-
E1
-
4.5
-
Solder land
opening
-
0.275
-
Notes
1.
Dimension b is measured at the maximum solder ball diameter,
parallel to datum plane C.
2.
Datum C (seating plane) is defined by the spherical crowns of
the solder ball.
3.
Parallelism measurement shall exclude any effect of mark on
top surface of package.
Description
68-ball Very Thin, Fine Pitch Ball Grid Array (VFBGA) Package
Size
5.5 x 5.5 x 1mm
JEDEC
MO-225
Pitch
0.5mm
Units
mm
Advance Information
This material is subject to CSR's non-disclosure agreement
© Cambridge Silicon Radio Limited 2011
Page 21 of 110
CS-209182-DSP1
CSR8640 BGA
Data Sheet
