Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
CLD
-A
P90
Rev
3
Soldering & handling
Cree
®
Xlamp
®
XB-d leds
WWW
.CR
ee
.COM/XLAMP
TaBle of ConTenTS
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
inTroduCTion
This application note applies to XLamp XB-D LeDs
which have order codes in the following format.
XBDxxx-xx-xxxx-xxxxxxxxx
This application note explains how XLamp XB-D LeDs
and assemblies containing these LeDs should be
handled during manufacturing. Please read the entire
document to understand how to properly handle
XLamp XB-D LeDs.
Handling XLamp XB-D LeDs .................................2
Circuit Board Preparation & Layouts ......................4
Case Temperature (T
) Measurement Point .............4
Notes on Soldering XLamp XB-D LeDs ...................5
Moisture Sensitivity ............................................6
XLamp XB-D LED Reflow Soldering Characteristics ..7
Chemicals & Conformal Coatings ..........................8
Assembly Storage & Handling ...............................9
Tape and Reel - XB-D LeDs ................................ 10
Packaging & Labels ........................................... 11
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the
Cree logo and XLamp
®
are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not
a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.
