xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
Xlamp XB-d led refloW Soldering CharaCTeriSTiCS
In testing, Cree has found XLamp XB-D LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and
configurations of reflow soldering equipment.
Profile Feature
lead-Based Solder
lead-free Solder
Average Ramp-Up Rate (Ts
max
to Tp)
3 °C/second max.
3 °C/second max.
Preheat: Temperature Min (Ts
min
)
100 °C
150 °C
Preheat: Temperature Max (Ts
max
)
150 °C
200 °C
Preheat: Time (ts
min
to ts
max
)
60-120 seconds
60-180 seconds
Time Maintained Above: Temperature (T
L
)
183 °C
217 °C
Time Maintained Above: Time (t
L
)
60-150 seconds
60-150 seconds
Peak/Classification Temperature (Tp)
215 °C
260 °C
Time Within 5 °C of Actual Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-Down Rate
6 °C/second max.
6 °C/second max.
Time 25 °C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
