xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
aSSemBly STorage & handling
Do not stack PCBs or assemblies containing XLamp XB-D LEDs so that anything rests on the LED lens. Force applied
to the LeD lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XB-D LeDs should be
stacked in a way to allow at least 2 cm clearance above the LeD lens.
Do not use bubble wrap directly on top of XLamp XB-D LEDs. Force from the bubble wrap can potentially damage the
LeD.
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