xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
noTeS on Soldering Xlamp XB-d ledS
XLamp XB-D LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by
placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page.
Do not wave solder XLamp XB-D LeDs. Do not hand solder XLamp XB-D LeDs.
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Solder Paste Type
Cree strongly recommends using “no clean” solder pas
te with XLamp MPL-EZW LEDs
so that cleaning the PCB after reflow soldering is not required. Cree uses the following
solder paste internally:
Indium Corporation of America Part number 82676
Sn62/Pb36/Ag2 composition
Flux: NC-SMQ92J
Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of
solder. For the most consistent results an automated dispensing system or a solder stencil
printer is recommended. Cree has seen positive results using solder thickness that results
in a post reflow 3-mil (75µm) bond line.
Solder paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XB-D LEDs so that cleaning the PCB after reflow
soldering is not required. Cree uses Kester r276 solder paste internally.
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Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent
results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results
using solder thickness that results in a 3-mil (75-μm) bond line.
1 kester.com/Portals/0/documents/electronic-Assembly-Materials.pdf
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