xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
ChemiCalS & Conformal CoaTingS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a
complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical
Compatibility Application Note.
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The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has
developed for testing the compatibility of chemicals and materials with LeDs. You should also consult your regional Cree
Field Applications Engineer.
recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp XB-D LeDs.
• Water
• Isopropyl alcohol (IPA)
Chemicals Tested as harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals
to be harmful to XLamp XB-D LeDs. Cree recommends not using these chemicals anywhere in an LeD system containing
XLamp XB-D LeDs. The fumes from even small amounts of the chemicals may damage the LeDs.
• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
• Methyl acetate or ethyl acetate (i.e., nail polish remover)
• Cyanoacrylates (i.e., “Superglue”)
• Glycol ethers (including Radio Shack
®
Precision electronics Cleaner - dipropylene glycol monomethyl ether)
• Formaldehyde or butadiene (including Ashland PLIOBOND
®
adhesive)
