xlamp xB-D leD solDering & hanDling
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
4
4
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree.com.
CirCuiT Board preparaTion & layouTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before
placing or soldering XLamp XB-D LeDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp XB-D LeDs.
CaSe TemperaTure (T
S
) meaSuremenT poinT
XLamp XB-D LeD case temperature (T
s
) should be measured on the PCB surface, as close to the LeD’s thermal pad as
possible. This measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB-D LeD itself. In testing,
Cree has found such a solder pad to have insignificant impact on the resulting T
s
measurement.
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
1
2
3
4
5
6
6
5
4
3
2
1
A
B
C
D
Phone (919) 313-5300
Fax (919) 313-5558
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT
THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ±
.5 °
.XXX ±
.25
.XX ±
.75
.X ±
1.5
FOR SHEET METAL PARTS ONLY
.XX ±
.25
.XXX ±
.125
X° ±
.5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
2.45
2.45
0.65
0.76
1.84
0.355
2.285
0.923
0.462
0.817
1.633
R1.086
0.82
0.36
0.46
2.34
0.36
0.28
0.36
0.92
2.34
2.272
1.136
2.272
0.284
0.284
0.426
0.852
0.426
0.284
1
/
1
30.000
A
2610-00019
2525 SBC HEW OUTLINE
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09/19/11
D. CRONIN
REVISONS
REV
DESCRIPTION
BY
DATE
APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
Recommended PCB Solder Pad
Recommended Stencil Pattern
Pad for thermocouple
Thermocouple site
if no separate pad
All dimensions in mm.
