Schematics
TSEV83102G0B - Evaluation Board User Guide
6-3
2166B–BDC–04/03
Figure 6-2. Component Side Description
Figure 6-3. Metal Layer 2 and 4: Ground Planes
Figure 6-4. Metal Layer 3 and 3 bis: Power Supplies
and Ground Planes
Figure 6-5. Metal Layer 5: Solder Side
Figure 6-6. TSEV83102G0B Evaluation Board: Top View
(Signal Side) without Heatsink
Figure 6-7. TSEV83102G0B Evaluation Board:
Bottom View
