Package Description
TSEV83102G0B - Evaluation Board User Guide
5-3
2166B–BDC–04/03
5.2
Thermal
Characteristics
5.2.1
Thermal Resistance
from Junction to
Ambient: Rthja
Table 5-2 lists the converter’s thermal performance parameters of the device itself, with
no external heatsink added.
DIODE
A10
Decimation function enable or die junction temperature
monitoring:
- Decimation active when LOW (die junction temperature
monitoring NOT possible)
- Normal mode when HIGH or left floating
- Die junction temperature monitoring when current is
applied
PGEB
A9
Active low pattern generator enable
- Digitized input delivered at outputs according to B/GB if
PGEB is floating or connected to GND
- Checkerboard pattern delivered at outputs if PGEB is
driven with ECL low level or connected to V
EE
DRRB
N1
Asynchronous Data Ready Reset function
GA
R9
Gain Adjust
SDA
A6
Sampling delay adjust
SDAEN
P1
Sampling delay adjust enable:
- inactive if floating or connected to GND
- active if ECL low or connected to V
EE
Table 5-1. TSEV83102G0B Pin Description (Continued)
Symbol
Pin Number
Function
Table 5-2. Thermal Resistance
Air Flow (m/s)
Estimated ja Thermal
Resistance (
°
C/W)
0
45
Figure 5-2. Thermal Resistance from Junction to Ambient: Rthja
0.5
35.8
1
30.8
1.5
27.4
2
24.9
2.5
23
3
21.5
4
19.3
5
17.7
Rthja (
°
C/W)
Air flow (m/s)
0
0
10
20
30
40
50
1
2
3
4
5
