6.3 Thermal Design Power
The thermal design power is defined as the power dissipated by the GPU and HBM
while running a selected application at up to the maximum recommended operating
temperature, and is measured as the maximum average power in a five-second
moving window.
The thermal design power is intended as a recommended thermal design point; it is
not an absolute maximum power under all conditions.
"Vega 10" has up to eight defined Dynamic Power Management (DPM) states, from
DPM_0 to DPM_7, in ascending order of performance and power. When a graphics-
demanding application (such as a game) is running, AMD's PowerTune constantly
switches GPU among the states based on run-time analysis of GPU activities, power
and thermal conditions. The effective power/performance depends on the percentage
of time spent in each state.
The data are targets only, and are subject to change.
Table 6–3 TGP for Discrete Variants
Variant
"Vega 10 - XTX"
VDDCR_SOC (V)
0.80 - 1.25
VDDCI_MEM (V)
0.90
VDDCR_HBM/VDDIO_MEM (V) 1.35
DPM Level
GFXCLK (MHz)
SOCCLK (MHz)
UCLK (HBM) (MHz)
DPM_7
1600
1107
945
DPM_6
1528
1107
945
DPM_5
1440
1107
945
DPM_4
1348
1028
945
DPM_3
1269
960
945
DPM_2
1138
847
800
DPM_1
991
720
500
DPM_0
852
600
500
Memory Interface (bits)
2048
GPU Leakage
Variable
GPU Die Temperature (
℃
)
85 (air cooled)
70 (liquid cooled)
Driver
17.20
Test Platform
Intel Core™ i7-4790X Extreme Edition 3.6-GHz CPU, 16-GB RAM
PCIe® Configuration
PCIe revision 3.0, up to 8.0 GT/s
TGP Targets (W)
1
220 (air cooled)
300 (liquid cooled)
Note:
1.
Total consumption by GPU and HBM memory.
6.4 Thermal Diode Characteristics
For "Vega 10", the ideality factor of the on-die thermal diode varies significantly with
temperature and sourcing current. If a design chooses to use the GPU's on-die
66
Thermal Data
"Vega 10" Databook
56006_1.00
©
2017
Advanced Micro Devices, Inc.
AMD Confidential - Do not duplicate.
