6
Thermal Data
To link to a topic of interest, use the following list of linked cross-references:
•
•
Thermal Characteristics (p. 65)
•
•
Thermal Diode Characteristics (p. 66)
•
6.1 Thermal Models
For simplified thermal simulations, the Delphi model can be utilized. The compact
thermal model of the ASIC is provided in the following table.
Table 6–1 ASIC Compact Thermal Model
Variable
Value
θ
JC
: Junction to case thermal resistance (based on the two-resistor model).
Note: Case here means the center of the top of the GPU package.
0.02
℃
/W
θ
JB
: Junction to board thermal resistance (based on the two-resistor model). 2.81
℃
/W
6.2 Thermal Characteristics
Table 6–2 Thermal Characteristics
Variable
Value
T
j,op
: Maximum recommended operating temperature.
This is the maximum temperature at which the functionality is qualified and
tested. Operation above this temperature will negatively impact product
reliability.
This temperature is measured using an on-die temperature sensor near the
integrated thermal diode (see
Thermal Diode Characteristics (p. 66)
).
85
℃
(air cooled)
70
℃
(liquid cooled)
T
j,max
: Absolute maximum rated junction temperature.
This is the maximum allowable instantaneous GPU temperature, above
which damage to the GPU is likely.
This temperature is measured using an on-die temperature sensor near the
integrated thermal diode (see
Thermal Diode Characteristics (p. 66)
).
91
℃
(air cooled)
76
℃
(liquid cooled)
Minimum ambient operating temperature.
0
℃
©
2017
Advanced Micro Devices, Inc.
AMD Confidential - Do not duplicate.
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