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Rockwell Automation Publication 2097-UM001D-EN-P - November 2012
Chapter 2
Installing the Kinetix 300 Drive System
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded together
may not share a common low impedance path. This difference in impedance may
affect networks and other devices that span multiple panels.
•
Bond the top and bottom of each subpanel to the cabinet by using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid. As a rule, the wider
and shorter the braid is, the better the bond.
•
Scrape the paint from around each fastener to maximize metal-to-metal
contact.
Figure 4 - Multiple Subpanels and Cabinet Recommendations
Wire Braid.
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Remove paint
from cabinet.
Ground bus
bonded to the
subpanel.
Wire Braid.
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)