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2. Transportation, Storage and Installation
2-23
TI 33J01J10-01EN
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Providing Space for Heat Dissipation
Leave space at the top and bottom of the device to permit heat dissipation.
• Separate the top of the instrumentation board at least 100 mm away from the ceiling, and
cut a ventilation hole of 200 cm
2
or larger in the ceiling or install a ventilation fan.
• Do not block the openings (ventilation holes) in the top and bottom surfaces of the device.
• A 1-unit (44.45 mm) or more space shall be provided between the Node Interface Unit and
other base plates.
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Providing Area for Servicing
Leave an area for servicing.
• All the work to connect cables to DIN rail mountable devices and I/O modules will be
performed from the front.
• The work to confirm indicator lamps, configure card settings, and remove/insert cards will be
performed from the front.
• The front is the area for wiring and servicing. Leave at least 1000 mm of space at the front.
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Compatible DIN Rail
Table Compatible DIN Rail Symbols (DIN 60715, JIS C 2812, IEC 60715, EN50022)
Cross section shapeType symbol
Width - height symbols
Material (chemical symbol)
TH
35-7.5
Fe or Al
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Installation of DIN Rail
• Install a DIN rail in a metal mounting plate with screws at 120-mm or less intervals.
• When mounting a DIN rail mountable device to a DIN rail, confirm that the device is securely
fixed after the mounting.
• Be sure to bring a DIN rail into contact with a mounting plate in order that the heat generated
from the DIN rail mountable device can be radiated to the mounting plate via the DIN rail.
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Grounding
Be sure to ground the equipment using the functional grounding terminal of the base plate.
Even if there is electrical conduction between the base plate and wall surface via the mounting
mechanism, the equipment must be grounded using the functional grounding terminal.
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Installation Orientation for base plate, node interface unit, and power unit
Mount the device to the DIN rail in the vertically correct orientation. Check the installation
orientation in General Specifications (GS).
Oct. 5, 2018-00
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