Toshiba SD-22VB, Руководство по обслуживанию

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B3-2
DISASSEMBLY INSTRUCTIONS
Supply soldering
from upper position
to lower position
IC
Supply the solder from the upper position of IC leads
sliding to the lower position of the IC leads.
(Refer to Fig. 3-6.) 2.
Fig. 3-6
Soldering Iron Solder
IC
Absorb the solder left on the lead using the Braided
Shield Wire. (Refer to Fig. 3-7.) 3.
Fig. 3-7
Soldering Iron
Braided Shield Wire
NOTE
Do not absorb the solder to excess.
IC
When bridge-soldering between terminals and/or the
soldering amount are not enough, resolder using a Thin-
tip Soldering Iron. (Refer to Fig. 3-8.) 4.
Fig. 3-8
Thin-tip Soldering Iron
NOTE
When the IC leads are bent during soldering and/or
repairing, do not repair the bending of leads. If the
bending of leads are repaired, the pattern may be
damaged. So, be always sure to replace the IC in this
case.
Finally, confirm the soldering status on four sides of the
IC using a magnifying glass.
Confirm that no abnormality is found on the soldering
position and installation position of the parts around the
IC. If some abnormality is found, correct by resoldering. 5.
Solder temporarily
Soldering Iron
INSTALLATION
Take care of the polarity of new IC and then install the
new IC fitting on the printed circuit pattern. Then solder
each lead on the diagonal positions of IC temporarily.
(Refer to Fig. 3-5.) 1.
Fig. 3-5
Solder temporarily