Themis Computer
3-1
3
3
Specification
3.1
Overview
The USPIIi-1v is available under four product configurations:
•
USPIIi-1v/1
, “USPIIi-1v Baseboard” is the single slot baseboard.
•
USPIIi-1v/2c
, “USPIIi-1v with Graphics and Expanded I/O” provides the USPIIi-1v baseboard and, in
the second slot, an I/O Expansion board and an optional Creator Graphics card.
•
USPIIi-1v/2p
, “USPIIi-1v with a PMC Carrier Board” provides the USPIIi-1v baseboard and, in the
second slot, a triple PMC Carrier board.
•
USPIIi-1v/3
, “USPIIi-1v with Graphics, Expanded I/O, and PMC Carrier Board” provides the all the
features in the “USPIIi-1v with Graphics and Expanded I/O” and the “USPIIi-1v with a PMC Carrier
Board”. The optional Creator Graphics card and Expanded I/O are located in the second slot. The PMC
Carrier board is located in the third slot.
The Creator Graphics card is physically separate from the I/O board and is completely optional. It is also
possible to have the Baseboard with Creator Graphics without the I/O board or the Baseboard with the I/O
Board but without Creator Graphics card. These options are also possible with the triple slot version of the
USPIIi-1v.
A single slot, P2 paddle board is also available for the Baseboard and the I/O Board. The paddle board
provides I/O connections for the MII, SCSI, and Serial signals.
3.1.1
Baseboard
The USPIIi-1v Baseboard is intended to provide an UltraSPARC-IIi platform in an industry standard single
slot, 6U, VME form factor. It has been optimized for service in the telecommunications and embedded
systems industries. The baseboard is implemented as a single slot VMEbus board with an on board
UltraSPARC-IIi processor/cache complex and proprietary coplanar memory boards. The UltraSPARC-IIi is
available in 360 MHz or 440 MHz with 2 MB external cache.
The memory subsystem utilizes a family of proprietary, coplanar, stackable DRAM memory modules of
either 64 MB, 128MB, 256 MB or 512 MB per module. Memory configurations of 64 MB, 128 MB, 256 MB,
512 MB, and 1GB are supported.
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