USPIIe-USB Hardware Manual
1-2
Themis Computer
For example:
[
USPIIe
-USB
/1-512-512-600 A1
] [
S1300786
]
— Board Type: USPII
e
-USB/1—Revision: A1
— L2 Cache: 512 KBytes—Serial Number: S1300786
— SDRAM: 512 MBytes—CPU Frequency: 600 MHz
To install the USPII
e
-USB, a standard VME chassis with a P1/P2 backplane (3-row
or 5- row connector) is required. If the USPII
e
-USB is to be used in a workstation
configuration instead of an embedded controller, a hard disk and graphics frame
buffer or serial terminal will also be required.
1.2
Check Configurations
When you first receive the USPII
e
-USB, confirm that the jumper-pin and solder-
bead configurations are appropriate for your application. Appendix B, ”DIP-Switch,
Jumper-Pin, and Solder-Bead Configurations” gives a complete listing of jumper-
pin and solder-bead definitions, including default settings.
If you have to change a jumper-pin setting, check with Themis Customer Support
first to make sure the new setting is supported.
Solder-bead settings are set by Themis at the factory before shipping and should be
changed by Themis at the factory only.
The following section describes the proper configuration for the mini-DIN-8 con-
nector on the Baseboard front panel.
Warning:
Attempting to alter a solder-bead configuration could seriously damage
the USPII
e
-USB. DO NOT ATTEMPT TO ALTER SOLDER-BEAD CONFIGU-
RATIONS. Instead, contact Themis to change any settings.
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