Multicore Fixed and Floating-Point System-on-Chip
Copyright 2012 Texas Instruments Incorporated
Mechanical Data
221
SPRS689D—March 2012
TMS320C6670
B Mechanical Data
B.1 Thermal Data
shows the thermal resistance characteristics for the PBGA - CYP mechanical package.
B.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
Table B-1
Thermal Resistance Characteristics (PBGA Package) [CYP]
No.
°C/W
1 R
θ
JC
Junction-to-case
0.15
2 R
θ
JB
Junction-to-board
3.04
End of Table B-1
Содержание TMS320C6670
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