Package characteristics
STM32L151x6/8/B, STM32L152x6/8/B
112/129
DocID17659 Rev 10
Figure 38. UFQFPN48 7 x 7 mm 0.5 mm pitch, ultra thin fine-pitch quad flat no-lead
package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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