STMicroelectronics STM32L151C6, Руководство пользователя

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Revision history STM32L151x6/8/B, STM32L152x6/8/B
128/129 DocID17659 Rev 10
12-Nov-2013
9
(continued)
Updated Table 54: ADC characteristics and Figure 27: Typical
connection diagram using the ADC .
Table 58: Temperature sensor calibration values was previously in
Section 3.10.1: Temperature sensor . Updated Table 59:
Temperature sensor characteristics .
In Table 61: Comparator 2 characteristics , parameter dThreshold/dt,
replaced any occurrence of “VREF+” by “V
REFINT
”Updated
Table 63: LQPF100 14 x 14 mm, 100-pin low-profile quad flat
package mechanical data
, Table 64: LQFP64 10 x 10 mm 64-pin
low-profile quad flat package mechanical data , Table 65: LQFP48 7
x 7 mm, 48-pin low-profile quad flat package mechanical data and
Table 66: UFQFPN48 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch
quad flat no-lead package mechanical data
.
Updated Figure 33: Recommended footprint .
Updated Figure 41: TFBGA64 - 5.0x5.0x1.2 mm, 0.5 mm pitch, thin
fine-pitch ball grid array package outline title.
Remove minimum and typical values of A dimension in Table 67:
UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball
grid array package mechanical data
Deleted second footnote in Figure 39: Recommended footprint .
Updated Section 8: Part numbering title and added first sentence.
Changed BOR disabled option identifier in Table 70: Ordering
information scheme .
22-Jul-2014 10
Updated Figure 14 , Figure 15 ;
Updated Table 5 ;
Updated Figure 6.3.4
Udded note 5 inside Table 54
Updated Ro value inside Table 54
Table 71. Document revision history (continued)
Date Revision Changes