Sony UP-CX2, Руководство по обслуживанию

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5-5 (E)
UP-CX2
. [Ribbon|sense]
: Checks the ribbon detection and ribbon sensing.
Con fi rmation object: 1-wire interface (CT-266/267/268 board), ribbon (Y) start
mark sensor/RM-204 and RM-208 boards, and ribbon
(MCL) start mark sensor/RM-209 and RM-210 board
Con fi rmation method: 1. When installing/removing the ribbon cassette, the unit
sounds bleep.
2. When clicking the
[Ribbon|sense]
button with the
ribbon cassette installed, shifts the thermal head to down-
ward, winds the ribbon for about 15 seconds, then shifts
the thermal head to upward. When Y start mark is passed
through, pin 1 of CN405 on the MEC-33 board changes
to high from low. When M/C/L start mark is passed
through, pin 4 of CN405 on the MEC-33 board changes
to high from low.
. [Head]
: Checks the shifting the position of thermal head.
Con
fi rmation object: Head position motor, SU-114 board, and position sensor/
HP-131 board
Con fi rmation method: When clicking the
[Head]
button, head position is intermit-
tently shifted in the order of home, tray, media transport,
print, and home. Pins 7 and 8 of CN403 on the MEC-33
board change as following at each position.
.
Pin 7: Changes to high from low seven times.
.
Pin 8: Changes to high from low once.
. [Cutter]
: Check the cutter movement.
Con
fi rmation object: Cutter unit
Con fi rmation method: When clicking the
[Cutter]
button, shifts the cutter from
side to side. When shifting the cutter, pins 1 and 3 of CN402
on the MEC-33 board change.
. [Print|step]
: Prints the test pattern (16STEP) required for density adjustment.
16STEP