©2018
Rev 2.0
7
Physical Description
2
Physical Description
Unpacking
All SignalCore products ship in antistatic packaging (bags) to prevent damage from electrostatic
discharge (ESD). Under certain conditions, an ESD event can instantly and permanently damage
several of the components found in SignalCore products. Therefore, to avoid damage when handling
any SignalCore hardware, you must take the following precautions:
1.
Ground yourself using a grounding strap or by touching a grounded metal object.
2.
Touch the antistatic bag to a grounded metal object before removing the hardware from
its packaging.
3.
NEVER touch exposed signal pins. Due to the inherent performance degradation caused by
ESD protection circuits in the RF path, the device has minimal ESD protection against direct
injection of ESD into the RF signal pins.
4.
When not in use, store all SignalCore products in their original antistatic bags.
Remove the product from its packaging and inspect it for loose components or any signs of damage.
Notify SignalCore immediately if the product appears damaged in any way.
Setting Up the Device
Integration of the SC5309A and SC5310A modules requires attention to maintain effective cooling.
Inadequate cooling can cause the temperature inside the RF housing to rise
above the maximum for
this product, leading to improper performance, reduction of product lifespan, or complete product
failure. SignalCore suggests providing moderate airflow across the RF housing. If active cooling is not
an option, use thermal interface materials to bond the RF housing to a larger heatsinking surface (i.e.
a system enclosure). As each
device’s integrated system configuration is unique
, detailed cooling
options cannot be provided.
A cooling plan is sufficient when the SC5309A and SC5310A on-board temperature sensors indicate a
rise of no more than 20°C above ambient temperature under normal operating conditions.