RTD Embedded Technologies, Inc.
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10
DMx820 User’s Manual
2
Specifications
Operating Conditions
Table 2: Operating Conditions
Symbo
l
Parameter
Test Condition
Min
Max
Unit
V
cc5
5V Supply Voltage
4.75
5.25 V
T
a
Operating Temperature
-40
+85 C
T
s
Storage Temperature
-55
+125 C
RH
Relative Humidity
Non-Condensing
0
90% %
MTBF
Mean Time Before Failure
Telcordia Issue 2
30°C, Ground benign,
controlled
3,292,579
Hour
s
Electrical Characteristics
Table 3: Electrical Characteristics
Symbo
l
Parameter
Test Condition
Min
Max
Unit
P
Power Consumption
V
cc5
= 5.0V
1.5 W
I
cc5
5V Input Supply Current
Active
300 mA
PCI Bus
V
IH
Input High Voltage
1.65
5.5 V
V
IL
Input Low Voltage
0
0.8 V
I
IL
PCI Input Leakage
0<V
I
<VIO
-10
10 uA
I
OZ
PCI Hi-Z Leakage
0<V
I
<VIO
10 uA
V
OH
Output High Voltage
2.97
V
V
OL
Output Low Voltage
0.33 V
PCIe Bus
Differential Output Voltage
0.8
1.2 V
DC Differential TX
Impedance
95.2
116.9
Ω
Differential Input Voltage
0.175
3.3 V
DC Differential RX
Impedance
92.7
115.8
Ω
Electrical Idle Detect
Threshold
61
173 mV
Digital I/O
V
IH
Input High Voltage
2.0
5.5 V
V
IL
Input Low Voltage
-0.5
0.8 V
V
OH
Output High Voltage
I
OH
= -24mA
2.4
V
V
OL
Output Low Voltage
I
OL
= 24mA
0.4 V
Notes
1.
DIO Vin DC overshoot must be limited to either 5.5V or 10mA and DC undershoot must be limited to
either -0.5V or 10mA.
2.
DIO pins may be driven to - 2.0V or + 7.0V provided these voltages last no longer than 11ns with a forcing
current no greater than 100mA.
3.
Inputs are terminated with 33Ω resistors and protection diodes.
4.
DIO inputs should not be tied to voltages when the board is not powered.