Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 27 of 680
REJ09B0145-0600
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X
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(0, 0)
Chip
size
:
3.55mm
×
3.77mm
Voltage level on the back of the chip : GND
Base type code
Type code
Figure 1.7 Bonding Pad Location Diagram of H8/38347 Group (Mask ROM Version)
and H8/38447 Group (Mask ROM Version) (Top View)
Содержание H8/38342
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