Rev. 6.00, 08/04, page 14 of 628
Table 1.2
Bonding Pad Coordinates of HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020
Coordinates
Coordinates
Pad No.
Pad Name
X (
µµµµ
m)
Y (
µµµµ
m)
Pad No.
Pad Name
X (
µµµµ
m)
Y (
µµµµ
m)
1
AV
CC
–1870
1546
42
P84/SEG29
1870
–1571
2
P13/TMIG
–1870
1274
43
P85/SEG30
1870
–1395
3
P14/
IRQ4
/
ADTRG
–1870
1058
44
P86/SEG31
1870
–1251
4
P16
–1870
909
45
P87/SEG32
1870
–1111
5
P17/
IRQ3
/TMIF
–1870
759
46
PA3/COM4
1870
–970
6
X1
–1870
608
47
PA2/COM3
1870
–831
7
X2
–1870
475
48
PA1/COM2
1870
–691
8
AV
SS
–1870
304
49
PA0/COM1
1870
–550
9
V
SS
–1870
173
50
V3
1870
–410
10
OSC2
–1870
–10
51
V2
1870
–270
11
OSC1
–1870
–150
52
V1
1870
–131
12
TEST
–1870
–290
53
V
CC
1870
10
13
RES
–1870
–425
54
V
SS
1870
150
14
P50/
WKP0
/SEG1
–1870
–560
55
P90/PWM1
1870
293
15
P51/
WKP1
/SEG2
–1870
–695
56
P91/PWM2
1870
489
16
P52/
WKP2
/SEG3
–1870
–831
57
P92
1870
685
17
P53/
WKP3
/SEG4
–1870
–966
58
P93
1870
880
18
P54/
WKP4
/SEG5
–1870
–1101
59
P94
1870
1076
19
P55/
WKP5
/SEG6
–1870
–1236
60
P95
1870
1274
20
P56/
WKP6
/SEG7
–1870
–1379
61
IRQAEC
1870
1546
21
P57/
WKP7
/SEG8
–1870
–1561
62
P30/UD
1782
1872
22
P60/SEG9
–1780
–1872
63
P31/TMOFL
1621
1872
23
P61/SEG10
–1621
–1872
64
P32/TMOFH
1084
1872
24
P62/SEG11
–1037
–1872
65
P33
948
1872
25
P63/SEG12
–896
–1872
66
P34
810
1872
26
P64/SEG13
–765
–1872
67
P35
673
1872
27
P65/SEG14
–635
–1872
68
P36/AEVH
536
1872
28
P66/SEG15
–502
–1872
69
P37/AEVL
311
1872
29
P67/SEG16
–371
–1872
70
P40/SCK32
176
1872
30
P70/SEG17
–239
–1872
71
P41/RXD32
38
1872
31
P71/SEG18
–108
–1872
72
P42/TXD32
–99
1872
32
P72/SEG19
23
–1872
73
P43/
IRQ0
–234
1872
33
P73/SEG20
156
–1872
74
PB0/AN0
–482
1872
34
P74/SEG21
287
–1872
75
PB1/AN1
–614
1872
35
P75/SEG22
419
–1872
76
PB2/AN2
–745
1872
36
P76/SEG23
550
–1872
77
PB3/AN3/
IRQ1
/TMIC
–878
1872
37
P77/SEG24
682
–1872
78
PB4/AN4
–1008
1872
38
P80/SEG25
833
–1872
79
PB5/AN5
–1148
1872
39
P81/SEG26
1040
–1872
80
PB6/AN6
–1621
1872
40
P82/SEG27
1621
–1872
81
PB7/AN7
–1782
1872
41
P83/SEG28
1782
–1872
Note:
V
SS
Pads (No. 8 and 9) should be connected to power supply lines.
TEST Pad (No. 12) should be connected to V
SS
.
If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the
coordinates of the centers of pads. The accuracy is ±5
µ
m. The home-point position is the chip’s center and the center
is located at half the distance between the upper and lower pads and left and right pads.
Содержание H8/38024 Series
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