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109
Chapter 8
Thermal Considerations
This chapter describes the thermal requirements to reliably operate a CPC5565 processor
board.
Thermal Requirements
The maximum processor die temperature allowed by the T7500 Core 2 Duo processor on the
CPC5565 is 100° C.
Caution:
To avoid damaging the CPU, do not exceed the maximum processor core temperature!
The maximum ambient air temperature required by the heat sink to maintain core temperature
below the maximum is 55° C. The maximum ambient air temperature assumes airflow of
300 LFM past the heat sink.
Caution:
External airflow must be provided at all times during operation to avoid damaging the CPU.
PT strongly recommends use of a fan tray below the card rack to supply the external airflow.
Temperature Monitoring
Because reliable long-term operation of the CPC5565 depends on maintaining proper
temperature, PT strongly recommends that you verify the operating temperature of the
processor (core) in your final system configuration.
The Core 2 Duo T7500 processor incorporates an on-die thermal diode that can be used to
monitor the processor's die temperature. While the IPMC checks the die temperature of the
processor for thermal monitoring, it relies on the Thermal Control Circuit (TCC) to manage the
processor temperature.
Intel Thermal Monitor
The Intel thermal monitor controls the processor temperature by modulating the processor core
clocks or by initiating an enhanced Intel SpeedStep technology transition when the processor
reaches its maximum temperature. The CPC5565 operates the thermal monitor in automatic
mode so that the thermal management is transparent to normal board operation.
If the Intel thermal monitor fails, the host CPU generates a hardware signal THERMTRIP_L to
immediately shut off power to the CPC5565.
See the topic “Processor” on page 117 , more information on how the Intel Core 2 Duo
processor thermal monitor functions.