4
TSP-16
1
2
3
4
A
B
C
D
E
F
1
2
3
4
1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING
1.2 NOTES ON REPLACING
1.3 SERVICE NOTICE
• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
The part listed below is difficult to replace as a discrete component part.
It the failure of suspected that are listed in the table, replace whole A
SS
Y.
Parts that is Difficult to Replace
ASSY Name
Ref No.
Part No.
Function
Remarks
IC201 MM
3
54
3
BH
DC/DC CONVERTER
IC with heat-pad
IC202 MM
3
54
3
BH
DC/DC CONVERTER
IC with heat-pad
IC501
NJW4155GM1-A
DC/DC CONVERTER
IC with heat-pad
IC502 MM
3
54
3
BH
DC/DC CONVERTER
IC with heat-pad
IC502 TP
S
2557DRB U
S
B POWER
S
W
IC with heat-pad
IC800
MMPF0100F0AEP
POWER MANAGEMENT IC
IC with heat-pad
IC2000 MCIMX6Q5EYM10AD
MAIN
uCOM
BGA
IC2
3
00 K4B4G1646D-BCMA
DDR
3
-RAM BGA
IC2
3
01 K4B4G1646D-BCMA
DDR
3
-RAM BGA
IC
3
800 THGBMHG6C1LBAWL
eMMC
BGA
S
200 A
S
G1102 POWER
S
W
Terminal part with through-hole
Terminal part with through-hole
JA2600 AKN7115
LAN
TERMINAL
(RJ-45)
JA
3
200 DKN1188
MIDI
IN
TERMINAL
(DIN)
Terminal part with through-hole
JA
3
201 DKN1188
MIDI
OUT/THRU
TERMINAL
(DIN)
Terminal part with through-hole
MAIN A
SS
Y
JA4100 DKN12
3
7 U
S
B-B TERMINAL
Terminal part with through-hole
IC5400
AK4458VN
MULTI -OUT DAC
IC with heat-pad
IC6000 AK4452VN
S
END DAC
IC with heat-pad
IC6600
AK4452VN
HEADPHONE DAC
IC with heat-pad
IO A
SS
Y
VR5200 DC
S
11
33
INPUT
LEVEL
VOLUME
Terminal part with through-hole
Terminal part with through-hole
MVR A
SS
Y VR6800
DC
S
11
3
4 MAIN
OUT
VOLUME
U
S
BA A
SS
Y JA7600
JA7600
U
S
B-A TERMINAL
Terminal part with through-hole
Terminal part with through-hole
IC7100 R1290K10
3
A
DC/DC CONVERTER
IC with heat-pad
IC7101
BD81A04EFV-M
DC/DC CONVERTER
IC with heat-pad
LCD A
SS
Y
S
9
3
21 D
S
X1080 ROTARY
S
ELECTOR (ENCODER)
CDC A
SS
Y IC7700
AD7147ACPZ500RL7
CDC (CAPACITANCE
S
EN
S
OR
S
IC)
IC with heat-pad
• Performance pad was calibrated when the product is produced. If a relevant part is replaced with a new one, be sure to
carry out the calibration.
• For the method of calibration, refer to "PAD CALIBRATION MODE" in "6.1 TE
S
T MODE".
• If you forget to carry out the calibration, power for tapping the performance pad and degree of sound volume when
the sampler velocity mode is turned ON vary depending on the pad.
• Calibration execution data is memorized in the MAIN A
SS
Y. Be sure to carry out the calibration when the MAIN A
SS
Y is
replaced new one.
Calibration of performance pad
• Don`t touch the black parts of the PADB A
SS
Y (side-A) and black mat parts of the
S
ensor (16 pieces each, which are
pressure sensitive ) with your bare hands.
Clear the dust between the PADB A
SS
Y,
S
heet,
S
ensor and Button (DEB20
3
7) by air blast when you assemble the sensor.
About PADB ASSY of sensors (Pressure sensitive)
• Clear the dust between inside of the Cap, Buttons and PCBs by air blast to remove the foreign particles when you assemble
S
EQ1 A
SS
Y,
S
EQ2 A
SS
Y or BAR A
SS
Y.
Caution: Control Panel and Chassis unit in the state that has wire does not open 180 degrees.
About SEQ1 ASSY, SEQ2 ASSY and BAR ASSY
• Replacement of the NAND (IC2601) in the MAIN A
SS
Y is not possible during service, because writing of the MAC address
on the production line is required. Therefore, the NAND (IC2601) are not supplied as a service part. If the NAND is defective,
replace the whole MAIN A
SS
Y.
About the NAND:Flash ROM IC(IC2601) in the MAIN ASSY
