NANO 1000S Polisher
I
NSTRUCTION
M
ANUAL
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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: [email protected] W eb: https://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
56
7.3 Polishing Pads
SEM Photograph
Polishing Pad Abrasive Application
Macro Image
CERMESH™ Metal Mesh Pad
– is a wire
mesh surface useful for coarse and
intermediate lapping / polishing. The texture of
this wire allows for the abrasive to become
semi-fixed; thus, offering the advantage of
increased stock removal while minimizing
damage.
POLYPAD™ Polishing Pad
– is a very tightly
woven and rugged polishing pad for
intermediate polishing. Provides good removal
and flatness.
TEXPAN™ Polishing Pad
– is commonly used
as an intermediate polishing pad for metals and
ceramics. It is low napped for superior edge
retention.
BLACK CHEM™ 2 Polishing Pad
– is a
porometric polymer pad which has a
consistency similar to a porous rubber type of
pad. It has a low nap and is widely used for
chemical mechanical polishing (CMP).
DACRON® 2 Polishing Pad
– is a low napped
polishing pad for polishing primarily with 1
– 9
micron diamond abrasives. It is also a very
effective pad for coarser alumina abrasives.
NYPAD™ Polishing Pad
– is a low napped silk
polishing pad for intermediate polishing
primarily with mid-sized intermediate diamond
abrasives.