NANO 1000S Polisher
I
NSTRUCTION
M
ANUAL
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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: [email protected] W eb: https://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
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4.8.3.9 CLASS 9: Metal Matrix Composites (MMC'S)
(Example: SiC Particles in Aluminum Matrix)
Abrasive / Surface
Lubricant
Force /
Sample
Speed
(Head /
Base)
Time
Individual
Force
Mode
Central
Force Mode
70-micron Diamond
grinding disk
Water
5
– 10 lbs.
200 / 200
rpm
Planar
N/A
Hard particles in a metal matrix can be
difficult to microstructurally prepare because
of particle pull-out as well as excessive
relief between the particles and the matrix.
The key to preparation of metal matrix
composites (MMC) is to minimize damage
at each preparation stage. This includes
sectioning with the appropriate diamond
wafering blade and using the finest
practical abrasive for initial grinding.
Polishing with SIAMAT colloidal silica
provides a chemical mechanical polishing
(CMP) action which is the most effective means for eliminating both surface
and subsurface damage. The combination of SIAMAT colloidal silica with
DIAMAT polycrystalline diamond also produces the required surfaces finishes
in a minimal amount of time.
Sectioning:
Diamond Wafering Blade - Medium Grit / Low Concentration
Mounting:
Castable Mounting with Epoxy or Acrylic resins.
Polishing: