Page: 117
Service Guide ML380
Chapter A Board Diagrams
A.2 INDEX TO CHARTS
Description
Board Designation
Section
Main Control Board (Original)
UMMB
A.2.01
Main Control Board (Current)
UMMB
A.2.02
RS-232C Serial Module
UMRS
A.2.03
Modifications to Main Control Board (UMMB)
There are two types of UMMB boards that you might encounter when servicing the Microline 380 printer.
Summary - UMMB: Original Board
The original board (refer to A.2.01) contains the following PROM/ ROM combination:
Q2 - contains a 256 K or a 512 K PROM in a socket. This PROM contains the printer control firmware.
Q3 - is a character generator ROM which is soldered to the printed circuit board.
The original board contains one jumper (SP4). Refer to A.2.01 for jumper placement information.
Summary - UMMB: Current Board
The current board
(refer to A.2.02
)
contains the following PROM/ ROM combination:
Q2 - contains a 1 MB MASK PROM in a socket. This PROM contains the printer control firmware and the
character generator.
Q3 - is an empty socket. However, if either the 256 K or 512 K PROMS are installed in Q2, a character
generator must be installed in Q3.
The current board contains three jumpers (SP4, 6 and 7). Refer to A.2.02 for jumper placement
information.
Copyright 1997, Okidata, Division of OKI America, Inc. All rights reserved. See the OKIDATA Business
Partner Exchange (BPX) for any updates to this material. (http://bpx.okidata.com)
Содержание ML380
Страница 36: ......
Страница 52: ...Partner Exchange BPX for any updates to this material http bpx okidata com...
Страница 56: ......
Страница 87: ...Partner Exchange BPX for any updates to this material http bpx okidata com...
Страница 93: ...Partner Exchange BPX for any updates to this material http bpx okidata com...
Страница 103: ...Partner Exchange BPX for any updates to this material http bpx okidata com...
Страница 132: ...Page 89 Service Guide ML380 Chapter 4 Failure Repair Analysis 4 5 ABNORMAL OUTPUT 4 5 01 Output Samples...
Страница 196: ...Item Okidata P N Oki J P N Description Comments Refer to B 1 02 Disassembly Procedure...