NXP Semiconductors RDGD31603PHSEVM, Руководство пользователя

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NXP Semiconductors
UM11603
RDGD31603PHSEVM three-phase inverter reference design
Tables
Tab. 1. PCIe connector pin definitions .......................... 7
Tab. 2. Test points .........................................................9
Tab. 3. RDGD31603PHSEVM indicator
descriptions ..................................................... 11
Tab. 4. RDGD31603PHSEVM connector and
jumper descriptions ......................................... 12
Tab. 5. Power supply test point descriptions ............... 13
Tab. 6. SiC module pin connections ............................15
Tab. 7. Translator board jumper definitions .................18
Figures
Fig. 1. RDGD31603PHSEVM three-phase inverter
board voltage domains and interfaces .............. 6
Fig. 2. Gate driver pinout and board interface
connection PCIe 2×32 .......................................7
Fig. 3. RDGD31603PHSEVM test points ..................... 9
Fig. 4. RDGD31603PHSEVM indicator locations ....... 11
Fig. 5. RDGD31603PHSEVM connector and
jumper locations .............................................. 11
Fig. 6. Power supply test point locations ....................12
Fig. 7. Gate drive resistors for each phase high-
side and low-side ............................................ 13
Fig. 8. SiC module pin placement .............................. 14
Fig. 9. SiC module connection pins ............................15
Fig. 10. Freedom development platform ...................... 17
Fig. 11. Translator board .............................................. 18
Fig. 12. FRDM-KL25Z setup and interface ...................19
Fig. 13. Kit selection .....................................................21
Fig. 14. GUI settings menu .......................................... 22
Fig. 15. Loader settings ................................................23
Fig. 16. Logs settings ................................................... 23
Fig. 17. Register map settings ..................................... 24
Fig. 18. Tabs settings ................................................... 24
Fig. 19. Command Log area ........................................ 25
Fig. 20. Device pins settings and status menus ........... 25
Fig. 21. Pins tab functionality ....................................... 26
Fig. 22. Status tab functionality ....................................26
Fig. 23. Analog tab functionality ...................................27
Fig. 24. Register map ...................................................28
Fig. 25. Gate drive tab ................................................. 29
Fig. 26. Current sense tab ........................................... 30
Fig. 27. Desat and segmented drive tab ...................... 30
Fig. 28. Overtemperature tab ....................................... 31
Fig. 29. Undervoltage and overvoltage tab .................. 31
Fig. 30. Measurements tab ...........................................32
Fig. 31. Status tab ........................................................33
Fig. 32. Pulse tab ......................................................... 33
Fig. 33. Evaluation setup using KITGD3160TREVB
and FlexGUI .................................................... 36
Fig. 34. Evaluation setup using MPC5777C-DEVB
MCU dev kit .................................................... 37
Fig. 35. Evaluation setup using MPC5744P MCU
dev kit ..............................................................37
UM11063 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
User manual Rev. 1 — 18 August 2021
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