NXP Semiconductors RDGD31603PHSEVM, Руководство пользователя

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NXP Semiconductors
UM11603
RDGD31603PHSEVM three-phase inverter reference design
Figure 9. SiC module connection pins
Connection name Pin description
G1 Gate high-side U phase
D1 Drain high-side U phase
S1_1 Source connection 1 high-side U phase
S1_2 Source connection 2 high-side U phase
T11 NTC temperature sensor connections U phase
T12 NTC temperature sensor connections U phase
G2 Gate low-side U phase
D2 Drain low-side U phase
S2_1 Source connection 1 low-side U phase
S2_2 Source connection 1 low-side U phase
T21 NTC temperature sensor connections V phase
T22 NTC temperature sensor connections V phase
G3 Gate high-side V phase
D3 Drain high-side V phase
S3_1 Source connection 1 high-side V phase
S3_2 Source connection 2 high-side V phase
T31 NTC temperature sensor connections W phase
T32 NTC temperature sensor connections W phase
G4 Gate low-side V phase
D4 Drain low-side V phase
S4_1 Source connection 1 low-side V phase
S4_2 Source connection 1 low-side V phase
Table 6. SiC module pin connections
UM11063 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
User manual Rev. 1 — 18 August 2021
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