NXP Semiconductors
UM11603
RDGD31603PHSEVM three-phase inverter reference design
4.2.8 SiC module pin connections
aaa-041547
Ø5.30
±0.15
26
.2
5
±0
.4
0
22.25
±0.40
14
±0.20
(3x)
(2
0)
N1
P1
N2
N3
P3
P2
G2
Depth (8
x)
D2
D1
S2
S2
G1
S1
S1
T11
T12
G4
D4
D3
S4
S4
G3
S3
S3
T21
T22
G4
D4
D5
S4
S4
G5
S5
S5
T31
T32
C
B
F
D
E
(5
.7
0)
0
(1
3.
30
)
(2
7.
33
)
(4
1.
30
)
(6
0.
30
)
(7
4.
67
)
(8
8.
30
)
(1
07
.3
0)
(1
22
)
12
8.
25
±0
.4
0
16
±0
.2
0
(3
x)
(16.25)
9.75
±0.40
5
±0.40
0
(82)
87
±0.40
90.75
±0.40
(114.25)
1
2
3
20.25
±0.40
25
±0
.4
0
14
±0.20
(3x)
(2
0)
0
(8
.3
0)
(2
7.
33
)
(5
5.
30
)
(7
4.
67
)
(8
7)
10
2.
30
)
(1
22
)
27
±0
.4
0
0
(3
x)
Figure 8. SiC module pin placement
UM11063
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2021. All rights reserved.
User manual
Rev. 1 — 18 August 2021
14 / 40