Nokia 603, Руководство по обслуживанию

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SIM interface
The phone has a SIM (Subscriber Identification Module) interface including a Micro SIM connector.
The SIM interface consists of an internal interface between RAPU and EM ASIC (N2200), and an external
interface between EM ASIC and SIM contacts.
Figure 44 SIM interface
The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM
card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is
used.
Device memory
The memory components of the device are internal COMBO POP4 4Gb DDR + 8Gb M3 (NAND), a card reader for
MicroSD, and 2GB eMMC memory which is non-removable and internal to the phone.
The MicroSD is used as a user’s data storage memory. The µSD card is connected to RAPU via EM ASIC which
has an internal level shifter with an ESD protection filter.
The device uses 2GB eMMC (D3200) external memory. The eMMC interface is a 6-wire serial/parallel data bus
which includes a clock (CLK), 4 data signals (DAT), and command (CMD) wires. The eMMC interface is completely
formed of the GENIOs of RAPU. The eMMC consists of an internal NAND controller and an MMC controller for I/
O interface. It is a dual supply device which requires VCC of 2.9V for the NAND core and VCCQ of 1.8V for the
MMC I/O interface.
BOB1.0M-b module
The BOB1.0M-b module provides full 802.11b, g & n WLAN, BT 2.1 + EDR, FM RDS and FM TX connectivity.
BOB is the name given to a generic technology release that combines WLAN, Bluetooth, FM Rx and FM TX radio
on a single monolithic IC. The FMTX functionality is disabled from RM-779. The phone uses BOB1.0M-b module
that consists of a single chip transceiver WL1271, plus a separate RF front end (FE) device. The BOB1.0M-b
release operates in the 2.4GHz (ISM) and the 76-108MHz FM bands.
RM-779
System Module
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