Appendix 1. EMC Installation Guidelines
1.4 Panel Structure
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1.4.2 Measures for Door
(1) Use metal for all materials configuring the panel.
(2) When joining the door, use a gasket to lower the impedance of the contacting sections, or use a structure
with a large contact area as shown below.
(3) The EMI gasket or conductive packing must contact the metal surface uniformly and at the correct
position.
EMI gasket
(a) Use of gasket
(b) Large contact area
Control panel
Door
Cross-section drawing
Contact area
Control
panel
Door
(Note 1)
When not using a gasket, ground the control panel grounding with a grounding wire to lower the
door's impedance.
(Note 2)
Using screws to fix the plates that have been painted (attachment of packing) is the same as an
insulated state. Peel the paint and fix the screws.
1.4.3 Measures for Power Supply
(1) Shield the power supply section and insert a filter to prevent the noise from flowing in or out.
Selection of the noise filter capacity will differ according to the drive unit and devices being used.
Refer to the "EMC Installation Guidelines" (BNP-B8582-45).
Device
Radiated
noise
AC input
Noise
filter
NF
Partition
plate
Device
Radiated noise
AC input
Flow out
Conductive
noise
Conductive
noise
NF
Noise
filter
(Note 1)
The conductive noise can be suppressed by inserting a noise filter, but the radiated noise will flow
out.
(Note 2)
The conductive and radiated noise can both be suppressed by adding a partition plate to the noise
filter.