Medivance Arctic Sun Stat, Руководство по обслуживанию

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6
Service Manual
Chapter 2- Components
Hydraulic Components
Fluid Delivery Line – reusable dual lumen tubing that
connects the Control Module to the ArcticGel™ Pads.
Pumps
Circulation Pump – pumps water from the Circulation
Tank through the ArcticGel™ Pads.
Mixing Pump – Transfers cold water from the Chiller
Tank to the Circulation Tank.
Chiller Pump – continuously circulates the water from
the Chiller Tank through the chiller’s evaporator.
Tanks
Circulation Tank – contains temperature-controlled
water that supplies the ArcticGel™ Pads.
Chiller Tank – contains water that is maintained at
approximately 4°C.
Supply Tank – contains water that is used to replenish
the Circulation Tank when the ArcticGel™ Pads are filled.
Sensors
Outlet Monitor Temperature - T1 – located within the
Circulation Tank. Used to monitor the temperature of
water that supplies the ArcticGel™ Pads.
Outlet Control Temperature - T2 – located within the
Circulation Tank. Used to control the temperature of
water that supplies the ArcticGel™ Pads.
Inlet Temperature – T3 – located within the Inlet/Outlet
Manifold. Monitors the temperature of water returning
from the ArcticGel™ Pads.
Chiller Temperature – T4 – located within the Chiller
Tank. Used to control temperature of water in the Chiller
Tank.
Pressure Sensor – located within the Inlet/Outlet
Manifold. Used to maintain a constant negative pressure
within the ArcticGel™ Pads by controlling the speed of
the Circulation Pump.
Flow Sensor – located at the outlet of the Circulation
Pump. Monitors the flow rate in the Circulation Circuit.
Valves
Conditioning Valve – located within the Inlet/Outlet
Manifold. When open, allows water to circulate internally
when priming or preconditioning.
Fill Valve – located within the Inlet/Outlet Manifold.
When open, allows the Circulation Pump to draw water
into the system.
Vent Valve – located within the Inlet/Outlet Manifold.
When open, allows air to supply ArcticGel™ Pads and the
displaced water to be returned to the Supply Tank.
Heater – located in the Circulation Tank. The heater
consists of 4 heating rods. The heating element within
each rod is in series with a non-resettable thermal fuse,
which protects each rod against an over-temperature
condition.
Inlet/Outlet Manifold – connects to Fluid Delivery Line
and Fill Tube. Contains the valves, the inlet temperature
sensor, and the pressure sensor.
Chiller – a refrigeration unit that continuously cools the
evaporator.
Electronic Components
Transmission Interface Module (T.I.M.) – an integrated
transmission interface module located on top of the
Card Cage converts real time data for transmission to a
hospital EMR system.
Cables – power cord and temperature cables. Additional
adapter cables are available to purchase for use with
different manufacturers’ temperature probes. In addition,
temperature out cables can be purchased to allow output
of patient temperature to an external monitor. Please
refer to the Temperature Cables in Appendix D.
Panel ESD Board – located on the connector panel
bracket. Provides electrical isolation for YSI 400
compatible patient temperature input/output signal.
AC PCB – located below the Supply Tank. Includes
electromechanical relays to control mains power to the
chiller and heater. Also includes solid state relays to
control power to each of the four heating elements.
Power Supply – located next to the AC PCB. Converts AC
mains voltage to 24 VDC.
Power Circuit Card – located within the Card Cage.
Converts 24 VDC to lower DC voltages used by the system.
The Processor Circuit Card – located within the
Card Cage. Includes both the control and monitor
microprocessors and associated circuitry, including
nonvolatile memory.
The Isolation Circuit Card – located within the Card
Cage. Provides electrical isolation for the Patient
Temperature circuits to a level of 1500V.
The Input/Output Circuit Card – located within the Card
Cage. Contains circuits that monitor water temperature,
pressure and flow. Provides control for Circulation and
Mixing Pumps, valves, and Chiller.
The Backplane Circuit Card – located at the back of the
Card Cage. Interconnects the circuit cards within the card
cage.
Control Panel – located at the top of the Control
Module. Consists of touch screen, microprocessor, hard
drive, USB interface, and USB-powered speaker.