4. TROUBLE SHOOTING
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LGE Internal Use Only
Copyright © 01 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Soldering
Memory and
Shield can
1. Ready to
rework new
normal Memory.
. Be locate
exactly position
via pincette.
3. Apply heat via
heat-gun.
4. Be careful
when using
heat-gun for not
blowing up other
parts.
5. Find out
shield-can and
soldering
Ready to rework
memory
Soldering Memory IC.
Soldering shield
can.
Attaching
gold gasket
and assemble
1. Attach gold
gasket and
remove vinyl
through pincette.
. Assemble
other parts that
is disassembled
before.
3. Function test
after finishing
assemble.
Attach gold gasket
Assemble phone
Function test